Event Update Entire AM process chain — all in one place

Editor: Steffen Donath

Although Formnext is fully online this year, it still aims be the leading international marketplace for innovations in additive manufacturing and intelligent production.

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Formnext Connect will run from 10 to 12 November 2020.
Formnext Connect will run from 10 to 12 November 2020.
(Source: Mathias Kutt)

In the guise of Formnext Connect, the exhibition will feature, among other things, presentations and the latest innovations from world-leading exhibitors, intelligent matchmaking, and diverse supporting events to give participants a unique insight into specific technologies and recent developments in the industry.

“Formnext Connect offers an important platform for the AM community to efficiently showcase new products, exchange ideas, and discuss projects and business before the end of the year, even in times like these,” says Sascha F. Wenzler, Vice President Formnext at Mesago Messe Frankfurt GmbH.

Exhibitors include top global players from the world of additive and equipment manufacturing, such as 3D Systems, Additive Industries, Arburg, Carbon, EOS, Formlabs, GE Additive, HP, Markforged, Materialise, Mitsubishi Heavy Industries, Renishaw, Siemens, SLM Solutions, Stratasys and Trumpf. Some will be premiering their groundbreaking new products at Formnext Connect. Virtual exhibitors will also include many major companies from the entire process chain: Autodesk, BASF, Covestro, Dyemansion, Evonik, H.C. Starck, Heraeus, Höganäs, Oerlikon, Postprocess, as well as research institutes such as Fraunhofer Institute IPT, ILT, and IAPT and other companies in the fields of design, materials, hardware, software, post-processing, and quality assurance. Formnext Connect 2020 also provides an opportunity for the global start-up community to present itself and engage with users or potential investors.

Digital visitors can expect a host of fascinating panel discussions on a wide range of topics from the AM world. For more detailed information, there will also be a number of sessions targeted at specific groups as well as roundtable discussions, which may also be organised and offered by exhibitors. These will provide an opportunity to explain technological developments in more detail, for example.

Connecting potential business partners through AI

AI-assisted matchmaking software will be used to offer suggested business contacts on the basis of the information and preferences supplied by exhibitors and visitors. “Our focus of connecting participants, who have questions, with expert exhibitors was a deliberate choice. This allows a direct exchange and brings the greatest possible added value for the participants,” explains Wenzler.

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