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In-Mould Structural Electronics Integrating electronics into 3D plastics — a manufacturing shift

From MA Alexander Stark 6 min Reading Time

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Electronics are moving off circuit boards and into the structure of the plastic part itself. Tactotek’s IMSE approach is driving this shift, combining design freedom with robust functionality — and prompting mould makers to rethink how tools, films, and processes are engineered for next-generation applications.

Lightline integrated into an IMSE component, showing how conductive traces and LEDs are moulded directly into the part to create uniform, sealed illumination without separate circuit boards.(Source: Tactotec)
Lightline integrated into an IMSE component, showing how conductive traces and LEDs are moulded directly into the part to create uniform, sealed illumination without separate circuit boards.
(Source: Tactotec)

Integrating electronics directly into 3D-moulded structures is no longer a futuristic concept. With its IMSE (In-Mould Structural Electronics) technology, Tactotek is moving this approach into mainstream manufacturing — bringing new design freedoms, new material combinations, and new requirements for tooling and mould making. Marko Suo-Anttila, SVP of Customer Solutions, and Tuomas Nieminen, VP of Technology Development, share how IMSE works, where it is heading, and what toolmakers need to know.

At the heart of IMSE is a straightforward but transformative idea: merging electronics seamlessly into the structure of the part. “IMSE integrates conductive traces, electronic components, and decorative surfaces into a single 3D moulded structure,” explains Suo-Anttila. “Instead of assembling multiple separate parts and wire harnesses, we embed everything inside the plastic during the moulding process.”

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