Company News New technology and research centre for Plasmatreat
Plasma Campus, Plasmatreat's new technology and research centre at the company headquarters in Steinhagen, Germany, will be opening on 30 October 2019.
Plasmatreat's new technology and research centre, Plasma Campus is a 1,400 sq.m. facility, which will house the company's development of new areas of application for plasma technology. It will also accommodate seminar and conference capacities for up to 200 participants as well as make room for machine-acceptance tests and customer trainings. The centre has various divisions, which will focus on the development of plasma solutions for a wide variety of applications. The staff here will work on both processes related to plasma coatings and open-air plasma technology for electronics production, which will be continuously developed.
Plasmatreat MD Christian Buske explains: "Open-air plasma technology offers a multitude of applications for electronics production. It ranges from the surface cleaning of lead frames to micro-cleaning of contact surfaces of bond pads prior to wire bonding. Even in printed circuit board production, oxidation layers can be removed from copper surfaces using plasma.” Buske adds that open-air plasma is also used in actual component production, like in cleaning printed circuit boards prior to conformal coating and even to ensure strong bonds between various materials using plasma activation before casting for final device construction — all of which are several areas of application in electronics production.
The company notes that the new premises will also be used for training and further education in plasma technology. Buske says that apart from standard applications, many other application areas are still not explored. Machine manufacturers, for example, are now considering the integration of open-air plasma technology in production systems, which is where the new technology and research center will be a venue to intensify its work with customers on new solutions and areas of application.