15.03.2016 Molding Innovation Days 2016

Editor: Briggette Jaya

The Moldex3D Molding Innovation Day in Switzerland will take place at the University of Applied Sciences. The meeting is designed for both users and prospectives to share and exchange knowledge and ideas within the field of plastic injection.

Related Company

(Source: Simpatec)

During this one day event advanced processes (MuCell, GAIM, WAIM, etc..) and new prototyping technologies (LWC Light Weight Components) will be introduced and shared customers’ experiences about using special materials in production. Moreover, new possibilities of Moldex3D R14 will also be introduced as well as the solutions for specific problems etc. Conference language is German.

www.simpatec.com

Venue: University of Applied Sciences, Rapperswil, Switzerland

(ID:43548039)