Trumpf Laser marking in a new demension
The Laser World of Photonics, the International Trade Fair for Photonics Components, Systems and Applications, has been held in Munich from 24 to 27 June 2017. The trade fair combines technology with industrial application sectors for the widest variety of industries and uses. On 600 square metres of exhibition space, Trumpf presented their latest developments and products, including the Tru-Mark 6030.
One of the features of the Tru-Mark 6030 is its ability to shorten process times by up to 25 percent. To achieve this, the Trumpf engineers boosted the available pulse energy and increased the average power on the workpiece to 25 watts, the company says. They also equipped the marking laser with a Yb beam source. This offers outstanding beam quality and high power densities, enabling the laser to achieve clean ablation and high-contrast marking.
According to Trumpf, the output of the Tru-Mark 6030 can be precisely scaled across its entire operational range without varying the laser properties. The intelligent system measures the pump and laser output inside the laser, and a power controller ensures that the marking laser is always operated at the desired output. The fact that every marking laser has the same performance curves makes it easy for users to add a second production line, safe in the knowledge that the marking results will be completely identical right from the start and will remain constant even after producing several million parts.
Marking 3D parts previously required the use of indirect methods. But the Tru-Tops Mark 3.0 marking software makes life much easier for users, Trumpf says. Based on the fully-featured 3D CAD marking system, the Tru-Mark 6030 is capable of dealing with 3D surfaces on complex parts, all thanks to its ability to shift the focus point along the z-axis by up to 50 millimeters. Power densities remain just as high during this process, with no change in the laser parameters. As well as full 3D support, the marking software also offers intuitive operation and a modular configuration.